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Mushkin Announces New Heatsink Design for High Performance PC's

Company: Mushkin Memory, Inc.
Product: New Heatsink Design
Date Published: July 30, 2005
Author: Jason Rabel

Mushkin Announces New Heatsink Design for High Performance PCs

Denver, CO, July 28, 2005 - Mushkin announces a new heatsink for high performance DRAM memory modules. The new heatsink is designed to handle the increased thermal demands of today's high performance PCs. The new design delivers superior thermal conductivity and dissipation. It's sleek and aero-efficient design provides 58% more surface area than Mushkin's previous heatsink.

"By opening up the design we improved airflow in and around the memory module and increased the surface area," says Brian Flood, head of Mushkin's product development. "It's far superior in performance and appearance."

Additionally, the new design utilizes an advanced thermal adhesive with double the thermal conductivity of the previous material. Mushkin is using the new heatsink on all its performance DDR and DDR2 products, such as the Redline series products that benefit the most from the new design, like the popular Redline and Xtreme series products. Expect to see the new heatsink on all Mushkin performance DDR products.


A Few Sample Pictures:

As can be seen from the sample Mushkin sent, the new heatsink is a giant leap from the original model.

The new heatsink is slightly taller, it definitely looks like it does a better job mounting flush to the memory chips, helping to dissipate heat. (If you note the older version in the picture above, the raised edges around the heatsink prevented that area from touching the memory chips.) The top edge has rounded grooves cut out to allow airflow throughout the module, again helping to dissipate heat.

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