Asetek VapoChill LightSpeed [AC]

Installation of the VapoChill:

Installation is an exact process but by no means difficult. The only truly challenging part of the installation process is the cutout that must be made to the left rear of the case to accommodate the evaporator head. First, the supplied cutout template is taped to the bottom of the case. Next, using either a drill and jigsaw or a Dremel tool (which is what I used), the specified section is carefully cutout. Lastly, a drill is needed to drill the four mounting holes as marked on the template. Asetek recommends you perform this step on an empty case, but I did it safely by removing the motherboard and PCI/AGP cards. I just made sure to lay the case on it's side while I was cutting and clean away the metal shavings often. After making the cutout I used a grinding stone on the Dremel to smooth out the edges where I cut.

Next, I prepared the clamshell by adhering the heating element to the inside, pulling the evaporator head through the hole, inserting the two top inserts into the clamshell behind the evaporator head, pulling the evaporator head back into the clamshell, then finally pressing in the bottom insert around the evaporator head. As per the instructions, I made sure there was about 2mm of protrusion by the evaporator head sticking out of the clamshell. Also at this point I ensured that the insulation hose for the evaporator head was fully inserted into the top of the clamshell with no gaps.

Next I began preparation of the CPU socket by removing the stock Intel retention mechanism, adhering the heating element and neoprene pad onto the socket backplate, then attaching the backplate to the motherboard with the four provided guides/washers/spacers. Also at this point, I applied the provided thermal compound to the socket itself, inserted the neoprene socket insulation pad, and installed the CPU.  The final bit of socket preparation was to place the correct bottom neoprene pad around the socket, remove the paper from it's adhesive side, install the top neoprene pad onto the bottom pad, and apply thermal compound to the top of the CPU.